unevenness

1.In the production process of PCB, there are many defects such as surface smudginess, solder mask unevenness, text excursion, pad damage, track damage etc.

在印刷电路板过程中,会外观不整洁、阻焊不均匀、文字偏移、线路及焊盘破损等缺陷。

2.Depth of field: with prqactices diode system (IDS), high-capacity ensures that the depth of field in the production of reliable. Autocompensation printing plate surface unevenness.

有了智能化二极管系统（IDS），高景深能力保证了可靠进行。自动补偿印版表面不均匀度。