At present there exist two kinds of manufacturing met hods for silicon-based lasers,i.e.,heteroepitaxy and bonding.
目前制作硅基激方法主要为两类,异质结外延生长和异质材料键。
At present there exist two kinds of manufacturing met hods for silicon-based lasers,i.e.,heteroepitaxy and bonding.
目前制作硅基激方法主要为两类,异质结外延生长和异质材料键。
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