The relative displacement between the front and retral loading location is emphasized.

着研究前后油缸加载点的相对位移。

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试的方法对肖特基器件后部封装中的压焊工艺进行优化设计。