Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的方法基器件后部封装中的压焊工艺进行了参数化设计。

The diode intrinsic noise temperature of some milimeter Schottky mixer diode was measured and reviewed. A measurement method was described at room and cooled temperature.

文一些毫米波基势混频二征噪声温度进行了测试和分析。介绍了在常温和致冷下混频二征噪声的测试方法。