1.Pei-Chi Chang, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang, "A Study on the Adhesion Between EMC and IC Encapsulation Mold", Automation Conference, P180 (2003).
8.There is a disconnect in the EMC (ElectroMagnetic Compatibility) world between system manufacturers testing systems for upset and device manufacturers testing devices for failure.